Technic Introduces the Semcon Fountain

Pawtucket, RI, USA – Technic has announced the newest addition to its SEMCON® line of equipment for wafer-level deposition. The Semcon Fountain is the latest development in the highly successful series of wafer plating tools by Technic. Expanding on the popularity of the Semcon for single wafer R&D processing and small-scale production, the Semcon Fountain offers additional options and features. One significant feature is a chamber design with a solution sparger that more closely resembles a full-scale production tool. The Semcon Fountain’s unique design orients the wafer in a more favorable horizontal position, mimicking most of the semiconductor mass production electroplating tools.

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The Semcon Fountain is capable of processing wafers up to 300 mm and utilizes a variety of wafer “cups” for different size wafers. The Semcon Fountain can achieve optimum processing for each application by adjusting the sparger, solution flow, and shielding. Each diameter-different cup allows for maximum tool flexibility by being able to run different wafer sizes using a single plating cell, making it extremely versatile and economical. The Semcon Fountain is ideal when setting up an electroplating process for the first time, or when introducing a new metal plating bath to an already existing electroplating process.

We could not be happier with the performance and versatility of the Semcon Fountain. We are currently operating in several locations including our R&D labs in Asia and the US for customer evaluations. The Semcon Fountain has performed with excellent results on a variety of substrates including Si, GaAs, InP, and others.

If you want to learn more, please visit our website Automatic Wafer ( Horizontal ) Plating Machine.

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                    Anthony Gallegos
                    Technic Global Product Manager for Semiconductor Technology

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This chapter introduces 15 kinds of main silicon wafer manufacturing equipment, including Single Crystal Growth Furnace, Float Zone Crystal Growth Furnace, Ingot Grinding Machines, Slicing Machines, Silicon Wafer Annealing Furnaces, Edge Rounding Machines, Lapping Machines, Wafer Etching Machines, Polishers, Double-Side Grinders, Single-Side Grinders, Edge Polishers, Double-Side Polishers, Single-Side Polishers, and Final Cleaning Equipment. For each equipment, we briefly describe process function, basic principle, main structure, basic parameters, as well as main products in the market and their providers. The purpose is to give a general concept of the equipment to the readers who are directly or indirectly involved in the wafer manufacturing industry. Since the process flow for wafers equal to and less than 200 mm is different from that for 300 mm wafer, only the typical process flow is explained with annotations for processes implemented specifically by 300 mm equipment.

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