Sputtering & Cathodic Arc Targets

Sputtering Targets For All shapes and Forms

Many companies turn to Sophisticated Alloys for sputtering targets and cathodic arc targets because they consider us the "one-stop-shop" they trust to provide high purity materials that meet their exacting specifications.

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Because all of our alloys are made in house in one of our many vacuum induction systems, we can formulate the exact alloy you need for your physical deposition requirement. A full analytic capability ensures that your product will meet your composition and purity requirements. We offer a full range of post-melt processing and complete machining capability so we can deliver your cathodic arc or sputtering target in whatever shape you desire in whatever quantity you need whether that’s a one-off target or production quantities.

For target assemblies requiring bonding we offer both indium and elastomeric bonds. Expedited services are also available.

Simplify Your Supply Chain

We think of Sophisticated Alloys as a "mini mill". We not only melt your material, we can also HIP, roll, extrude, heat treat and machine the material we produce for you. Why not simplify your supply chain and save yourself some time and money?

• Vacuum melted alloy targets
• Ceramic targets

Alloy Applications

• Wear Resistant Coatings
• Decorative Coatings
• Disk Drive Media & Heads

• Optical Coatings
• Solar Cells
• Thin Film Devices

Sputter coating is the core thin film deposition process in the semiconductor, disk drive, CD and optics industries today.

When a suitable gas (usually argon) and a target material (usually metals) are used to form a glow discharge between the cathode and the anode, the sputtering target is bombarded to cause the atoms to be ejected from the target material——the process is referred to as “sputtering”; the atoms of the sputtering target will be deposited on a substrate, such as a silicon wafer, solar panel or optical device, and this process is known as sputter deposition.

Sputter deposition, as a relatively common physical vapor deposition (PVD) method, has its advantages, such as a wide range of deposition materials and high coating quality.

The table below details the advantages and disadvantages of sputter coating. It is provided by Stanford Advanced Materials and is for informational purposes only.

(2) Replication of target composition in the deposited films.

(3) Capable of in-situ cleaning prior to film deposition by reversing the potential on the electrodes .

(4) Better film quality and step coverage than evaporation.

For more information, please visit Acetron.

(5) This is partly because adatoms are more  energetic, and film is ‘densified’ by in-situ ion bombardment, and it is easier to heat up to high T than evaporation that is in vacuum.

(6) More reproducible deposition control – same deposition rate for same process parameters (not true for evaporation), so easy film thickness control via time.

(7) Can use large area targets for uniform thickness over large substrates.

(8) Sufficient target material for many depositions.

(9) No x-ray damage.

(2) Higher pressures 1 –100 mtorr ( < 10-5 torr in evaporation), more contaminations unless using ultra clean gasses and ultra clean targets.

(3) Deposition rate of some materials quite low.

(4) Some materials (e.g., organics) degrade due to ionic bombardment.

(5) Most of the energy incident on the target becomes heat, which must be removed.

For more information, please visit https://www.sputtertargets.net/sputtering-target-materials.html.

Author:

SAM Sputter Targets

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. View all posts by SAM Sputter Targets

The company is the world’s best alloy sputtering target supplier. We are your one-stop shop for all needs. Our staff are highly-specialized and will help you find the product you need.